Modern applications present issues that are becoming increasingly difficult to solve with traditional 2D architectures, which has necessitated the need for research into 3D processing and memory architectures. A dominant problem in this field is that 3D architectures produce more heat than 2D architectures, yet are difficult to cool using traditional 2D approaches like heat sinks. New 3D cooling techniques are necessary, and with them, new ways to model these cooling techniques. My research has focused on taking HotSpot, an existing thermal modeling tool capable of modeling 3D architectures, and adding functionality for modeling 3D cooling techniques, with an emphasis on microchannel cooling.
Monday, December 10, 2018
HotSpot Extensions for Microchannels
(Trey West, UVA, presenting on Mon 12/10/18.)
Modern applications present issues that are becoming increasingly difficult to solve with traditional 2D architectures, which has necessitated the need for research into 3D processing and memory architectures. A dominant problem in this field is that 3D architectures produce more heat than 2D architectures, yet are difficult to cool using traditional 2D approaches like heat sinks. New 3D cooling techniques are necessary, and with them, new ways to model these cooling techniques. My research has focused on taking HotSpot, an existing thermal modeling tool capable of modeling 3D architectures, and adding functionality for modeling 3D cooling techniques, with an emphasis on microchannel cooling.
Modern applications present issues that are becoming increasingly difficult to solve with traditional 2D architectures, which has necessitated the need for research into 3D processing and memory architectures. A dominant problem in this field is that 3D architectures produce more heat than 2D architectures, yet are difficult to cool using traditional 2D approaches like heat sinks. New 3D cooling techniques are necessary, and with them, new ways to model these cooling techniques. My research has focused on taking HotSpot, an existing thermal modeling tool capable of modeling 3D architectures, and adding functionality for modeling 3D cooling techniques, with an emphasis on microchannel cooling.
